• Bonding
Displaying 1-10 of 183 documents Export Results

Cascaded Die Mountings with Spring-Loaded Contact-bond Options Cascaded Die Mountings with Spring-Loaded Contact-bond Options Disclosure Number 200201200 Technology Summary A power electronic semiconductor die wherein the mountings are cascaded with multiple bonding options allowing for improved liquid refrigerant cooling. Inventor ADAMS, DONALD J Eng…

: Fact Cards
: Bonding, Die, Science...

Additive Printing of Bonded Magnets Using Magnet Powders and a Polymer Composition Additive Printing of Bonded Magnets Using Magnet Powders and a Polymer Composition Disclosure Number 201603683 Technology Summary Methods of three-dimensional printing an object can include forming an object using a coreactive printing composition that is produced from a mixture of at least two coreactiv…

: Fact Cards
: Chemistry, Bonding, Polymer...

Alternative Stabilization Methods and Value-Added Derivatives from Polyolefin Carbon Precursors Alternative Stabilization Methods and Value-Added Derivatives from Polyolefin Carbon Precursors Disclosure Number 201002480 Technology Summary The present invention comprises an alternative to conventional stabilization methods (functionalization methods) to c…

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Improved Die and Lead Frame Bonding Via Directional Topography Disclosure Number 201202944 Technology Summary This invention improves the mechanical reliability of the joint used to bond semiconductors and lead frames to metal- cladded substrates. Surface modification or engineering of the metal cladding on ceramic substrates or the working area metallizat…

: Fact Cards
: Material Science, Bonding, Metal...

Novel 3D Printing Method to Fabricate Bonded Magnets of Complex Shape Novel 3D Printing Method to Fabricate Bonded Magnets of Complex Shape Disclosure Number 201503574 Technology Summary instead of structural reinforcement. Due the flow field within the nozzle during deposition, anisotropic particles preferentially align along the axis of the printed filament. High alignment of the par…

: Fact Cards
: Chemistry, Shaping, Bonding...

A Build Platform that Provides Mechanical Bonding with Additive Manufacturing Prints A Build Platform that Provides Mechanical Bonding with Additive Manufacturing Prints Disclosure Number 201303201 Technology Summary The invention relates to additive manufacturing and more specifically to a captive build platform for holding a part. A build surface with unique geometry is provided t…

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: Platform, Manufacturing, Bonding...

Coating Surfaces with Superhydrophobic Powder Researchers at ORNL have developed a method of modifying existing coating techniques to include a bonded superhydrophobic outer coating layer. Superhydrophobic powder will not readily bond to most substrates directly, since superhydrophobic powder is almost entirely made up of fluorinated particles of silica glass, which is chemically inert to most …

: Fact Sheets
: Superhydrophobic, Coating, Glass...

Additive Manufacturing of Bonded Permanent Magnets using a Novel Polymer Matrix Additive Manufacturing of Bonded Permanent Magnets using a Novel Polymer Matrix Disclosure Number 201403300 Technology Summary This invention disclosure reports a method of direct manufacturing of bonded magnets using a polymer extrusion based additive manufacturing and a new composition of matter. The bond…

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Superhydrophobic Thin Film Coatings Exploiting its expertise with thin films and superhydrophobic materials, ORNL has developed a simple, inexpensive way to apply and reliably bond superhydrophobic powder to various substrates, creating coatings that are both transparent and water repellant. Because of their many advantages and applications, numerous efforts have been made to develop superhydro…

Additive Manufacturing of Isotropic NdFeB Bonded Magnets Disclosure Number 201603797 Technology Summary Additive manufacturing allows for the production of complex parts with minimum material waste, offering an effective technique for fabricating permanent magnets which frequently involve critical rare earth elements. In this disclosure, we demonstrate a novel method - Big Area Additive…

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